Radioelektronikos terminų žodynas. – Vilnius : BĮ UAB „Litimo“. Kazimieras Gaivenis, Gytis Juška, Vidas Kalesinskas. 2000.
Wafer-scale integration — Wafer scale integration, WSI for short, is a yet unused system of building very large integrated circuit networks that use an entire silicon wafer to produce a single super chip . Through a combination of large size and reduced packaging, WSI… … Wikipedia
Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a … Wikipedia
Non-contact wafer testing — Wafer testing is a normal step in semiconductor device fabrication, used to detect defects in integrated circuits (IC) before they are assembled during the IC packaging step. Traditional (contact) wafer testing Probing ICs while they are still on … Wikipedia
Rapid thermal processing — (or RTP) refers to a semiconductor manufacturing process which heats silicon wafers to high temperatures (up to 1200 C or greater) on a timescale of several seconds or less. The wafers must be brought down (temperature) slow enough however, so… … Wikipedia
Waferbearbeitungsausrüstung — plokštelės apdirbimo įranga statusas T sritis radioelektronika atitikmenys: angl. wafer processing equipment vok. Waferbearbeitungsausrüstung, f rus. оборудование для технологической обработки пластин, n pranc. équipement pour le traitement… … Radioelektronikos terminų žodynas
plokštelės apdirbimo įranga — statusas T sritis radioelektronika atitikmenys: angl. wafer processing equipment vok. Waferbearbeitungsausrüstung, f rus. оборудование для технологической обработки пластин, n pranc. équipement pour le traitement technologique des tranches, m … Radioelektronikos terminų žodynas
équipement pour le traitement technologique des tranches — plokštelės apdirbimo įranga statusas T sritis radioelektronika atitikmenys: angl. wafer processing equipment vok. Waferbearbeitungsausrüstung, f rus. оборудование для технологической обработки пластин, n pranc. équipement pour le traitement… … Radioelektronikos terminų žodynas
оборудование для технологической обработки пластин — plokštelės apdirbimo įranga statusas T sritis radioelektronika atitikmenys: angl. wafer processing equipment vok. Waferbearbeitungsausrüstung, f rus. оборудование для технологической обработки пластин, n pranc. équipement pour le traitement… … Radioelektronikos terminų žodynas
Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 … Wikipedia
Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… … Wikipedia
